NEWS

Keiron Printing Technologies has raised €10M to revolutionize solder paste printing in electronics manufacturing with its industrialized solution based on Laser-Induced Forward Transfer (LiFT) technology, delivering nanolitre-level precision.

dEEPTECHXL
August 26, 2024

Eindhoven, The Netherlands – August 22, 2025 — Keiron PrintingTechnologies, the pioneer of Lift (Laser-induced Forward Transfer), introducesits patented technology that digitally prints solder paste with nanolitreprecision — delivering a faster, cleaner, more efficient and more flexiblealternative to traditional stencil or jet printing

KeironPrinting Technologies, the pioneer in Laser-induced Forward Transfer (Lift)precision solder paste deposition for next-generation electronicsmanufacturing, today announced it has topped up the seed round with another € 2.3million, with a total of €10 million. The investment was led by deep-techventure capital firms DeepTechXL and Cottonwood Technology Fund,with participation from TNO Ventures and Innovation Credit.

TheLift technology originates from TNO Holst Centre, a strategiccollaboration between TNO and imec. TNO remains Keiron’sprime strategic research partner.

Keiron is redefining what’s possible in electronicsmanufacturing. With our proprietary Lift technology, we achieve more than 2×the precision and control of traditional stencil printing. This disruptiveleap enables the next steps in miniaturization and the seamless integration ofadvanced AI-driven components into PCB assemblies. Beyond performance, itempowers both the European and US markets by enhancing technological securityand sovereignty—delivering unmatched flexibility for aerospace, defense,medical, and space industries where failure is not an option.

“Thisround marks a breakthrough moment for Keiron,” said Paul Rooimans, CEO ofKeiron Printing Technologies. “Thenew funding will fast-track the installation of Keiron’s first-of-its-kindindustrialized system worldwide — the HF2 LiFT Printer — while expandingR&D and operations and scaling production to deliver multiple systemsalready secured by leading customers in Europe and the United States.”

“Keiron’sLift Solder paste printing approach offers a rare combination of flexibility,precision, and scalability,” said Guus Frericks, Partner at DeepTechXL. “It’sthe type of foundational innovation that will reshape how complex electronicsare manufactured—while strengthening the technological sovereignty and securityof both Europe and the United States.”

“TNO has worked closelywith Keiron from the start, and we’re proud to deepen our collaboration as bothan investor and R&D partner,” said Rolph Segers, Technology TransferOfficer, TNO. “This is Dutch innovation with truly global impact.”

Keiron’s Lift technologyeliminates the need for stencils and tooling, enabling fast changeovers, higheryield, more output and dramatically improved volume control — all critical intoday's high-mix, low- to mid-volume production environments.

“Keironis poised to redefine advanced electronics manufacturing,” said Alain Le Loux,Partner at Cottonwood. “Their disruptive Lift approach is breaking industryconventions and driving electronics to new levels of miniaturization andquality.”

About Keiron PrintingTechnologies
Keiron Printing Technologies is a deep-tech company based in Eindhoven, TheNetherlands, developing digital Lift solderpaste precision printing systems forthe electronics manufacturing industry. With a focus on flexibility, accuracy, outputand process reliability, Keiron enables the next generation of high-complexityelectronics for aerospace, defense, medical, and industrial sectors.

Media Contact:
Paul Rooimans
CEO
Keiron Printing Technologies
p.rooimans@keirontechnologies.com
+31402097074
www.keirontechnologies.com

Eindhoven, The Netherlands – August 22, 2025 — Keiron PrintingTechnologies, the pioneer of Lift (Laser-induced Forward Transfer), introducesits patented technology that digitally prints solder paste with nanolitreprecision — delivering a faster, cleaner, more efficient and more flexiblealternative to traditional stencil or jet printing KeironPrinting Technologies, the pioneer in Laser-induced Forward Transfer (Lift)precision solder paste deposition for next-generation electronicsmanufacturing, today announced it has topped up the seed round with another € 2.3million, with a total of €10 million. The investment was led by deep-techventure capital firms DeepTechXL and Cottonwood Technology Fund,with participation from TNO Ventures and Innovation Credit.

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